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반도체 Technology를 선도하는 삼성전자 메모리사업부 미주채용담당 송경빈입니다.
다음과 같이 반도체 및 관련 전공자 분들을 모시고자 합니다.
- 다 음 -
1. 모집대상
○ 학사 이상 학위 소지자로 관련부문 경력자
- 박사학위 소지자('12 ~ '13년 졸업 예정자 가능)
- 석사학위 소지자로 2년 이상 경력 소지자
- 학사학위 소지자로 4년 이상 경력 소지자
2. 지원방법
○ 이력서접수 → kb0405.song@samsung.com
○ 지원기간 : 2012. 1. 26(목) ~ 2012. 2. 8(수), 24:00
3. 모집분야
○ H/W Design, S/W Design, Device Process, Manufacturing Technology,
Quality & Reliability Engineering for Semiconductor
※ 하단의 상세내역 참조
4. 전형절차
○ 지원서접수 → 지원서검토 → 면접전형(전화 or 현지면접) → 건강검진 → 최종합격
5. 기타
○ 이력서 검토 후 개별연락 예정
○ 2월 중순 ~ 3월 초 현지면접 예정(뉴저지, 오스틴, 산호세)
※ 세부일정 및 장소 추후 공지
○ 궁금하신 사항은 언제든지 문의주시기 바랍니다.
※ 담당자 : 송경빈(kb0405.song@samsung.com, +82-31-208-6065)
[모집분야]
□ Hardware Design
- DRAM(DDR/Mobile/Graphic), Flash Memory(Nor/Nand), PRAM, Analog & Digital Circuit
- Controller : RTL Coding, Synthesis, Static Timing Analysis,
AMBA-based bus protocol & ARM-based SoC chip design, DFT Implementation
SATA, SAS, PCIe, USB2.0/3.0, SD/MMC interface,
ARM-based embedded SW development & HW validation,
System Verilog Verification, FPGA Implementation & Verification,
Computer architecture (multi-core, memory subsystem, storage system architecture)
Network-on-chip, packet-based on-chip interconnect fabric, PCIe
Power management policies and standards, Performance modeling and evaluation,
Power modeling and evaluation
Signal Processing Algorithm Development for Memory & Storage System,
Channel Codes(Error Detection/Correction Codes) Design & HW/FW IP Design
□ Software Design
Flash Storage Architecture(Memory card, SSD), Flash memory Card, SSD Firmware Development
HW/SW Co-design(Parallel Processing, Multi-processor), Performance Analysis
Flash Memory Management Algorithm (FTL, Mapping, Wear-leveling, etc)
Storage System Host Interface(SD/MMC/UFS/UHS-II/S-ATA/SAS/PCIe/FC, etc)
Flash Storage HW/SW Modeling & Co-simulation(SystemC/TLM, VHDL/Verilog, FPGA)
OS(Linux/Windows/RTOS) Middle-ware & Kernel Development(Flash Memory File System,
Virtual Memory Management, Cache Algorithm, Dynamic Memory Management, I/O Scheduler, Device Driver)
SW Test & Automation Tool Development(Unit Test, Integration Test, System Test, Test Case Design,
Dependability, Fault Tolerant System Test),
SW Platform Architecture & Design(SW Product Line, Re-Engineering, ADD/QAW/ATAM, MDD, OOAD, Requirements Engineering),
SW Development Process Improvement (CMM/CMMi, SPICE, Agile, TDD, Configuration Management),
SW Project Management(PMO, SW Metrics), Compiler Technology, DBMS (DataBase Management System) Engine Algorithm,
RAID & Storage System Architecture
□ Device Process
Oxidation, Photo Resist, Photolithography, Etch, Diffusion, Cleaning, Thin Film,
Ion Impantation, CVD, Metallization, Device Isolation, Transistor, Capacitor,
Dielectric, SiO2/SiON Gate Dielectrics, High-K/Metal Gate, Device Analysis
□ Manufacturing Technology
- Yield Enhancement: Defect Reduction, Contamination Evaluation Technology,
Particle Detection, Gas Impurity Evaluation Technology, Surface/Chemical
Analysis Technology, Contamination Technology
- Metrology: Pattern Process Inspection, Critical Dimension Measurement
□ Quality & Reliability Engineering for Semiconductor
Accelerated Life/Degradation Test Modeling &Analysis,
System/Software Reliability & Warranty Engineering,
Virtual Metrology & APC (Advanced Process Control) Modeling,
Multi-Stage SPC (Statistical Process Control) and/or DOE (Design of Experiment),
Multivariate Modeling & Analysis (include Data Mining Methodology),
Sampling & Measurement Risk Modeling under Automated Dispatching System
□ Reliability Technology for Semiconductor
Device Reliability(DRAM, Flash), Advanced Gate Stack Reliability,
Novel Device Reliability(PCM, MRAM, etc), Device Characterization and Reliability Modeling,
Design-In Reliability, Interconnect Reliability, Electro-migration, Stress-migration,
BTS (Bias Temperature Stress), 3D interconnect, Thin Film Stress analysis,
Novel Materials for Interconnects Circuit Reliability, Failure Analysis & Life Time Projection ,
Package level reliability, Solder joint reliability, Board level reliability
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Kyoungbin Song
Human Resources Group
Memory Business, Device Solutions
SAMSUNG ELECTRONICS CO.,LTD
TEL : +82-31-208-6065
Mobile : +82-10-4130-9113
E-Mail : kb0405.song@samsung.com
